发明名称 ELECTRONIC COMPONENT ASSEMBLY STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide an electronic component assembly structure forming an electronic circuit by properly connecting electronic components to each other without soldering them. SOLUTION: In this electronic component assembly structure, a semicylindrical electronic housing part 21 for housing an electronic component 60, and lead housing grooves 22 and 23 are formed in a component holding member 20, and the electronic component 60 can be stably held by the component holding member 20. A bus bar member 40 is provided with a body part 41, and connection terminals 42 and 43 for connecting leads 62 and 63 to them, respectively, and can be connected to the leads 62 and 63 of the electronic component 60 without soldering them. Since the electronic component 60 is stably held by the component holding member 20, the leads 62 and 63 are never significantly damaged in connecting them. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008010322(A) 申请公布日期 2008.01.17
申请号 JP20060180273 申请日期 2006.06.29
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 YABU TAKENOBU;UENO SEIICHI
分类号 H01R9/03;H01R13/66;H05K7/06 主分类号 H01R9/03
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