发明名称 |
Verfahren zur Ausbildung einer Verbindung |
摘要 |
A method for forming a joint. A module is introduced including a paper or plastic substrate, an integrated circuit on a chip mounted on the substrate and in electrical contact with contact areas of the module being located on the surface of the substrate. A web is introduced including one circuitry pattern after another provided with contact areas of the circuitry pattern. Settable isotropically conductive adhesive is dispensed on the contact areas of the circuitry pattern. The contact areas of the module are attached to the contact areas of the circuitry pattern by the isotropically conductive adhesive. The isotropically conductive adhesive is cured at the ambient atmospheric pressure. Settable nonconductive adhesive is dispensed at the side of the module in such a manner that the adhesive is sucked underneath the module by capillary forces. The nonconductive adhesive is cured at the ambient atmospheric pressure. |
申请公布号 |
DE112004000956(T5) |
申请公布日期 |
2008.01.17 |
申请号 |
DE20041100956T |
申请日期 |
2004.06.01 |
申请人 |
UPM RAFLATAC OY |
发明人 |
HUHTASALO, LAURI;JAERVINEN, JUUSO;KOIVISTO, TERO;STROEMBERG, SAMULI |
分类号 |
G06K19/077;H01L21/56;H01L21/60;H01L23/498;H01R4/04 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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