| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface acoustic wave device that reduces insertion loss deterioration and can be miniaturized, and to provide a communication device using the surface acoustic wave device. <P>SOLUTION: First and second surface acoustic wave resonators 18, 19 are formed by connecting to both the sides of a center common busbar electrode 29 by the center common busbar electrode 29. An unbalanced I(O) terminal 22 is connected to the center common busbar electrode 29. Surface acoustic wave elements 20, 21 and the first and second surface acoustic wave resonators 18, 19 are arranged adjacently in a direction orthogonally crossing a propagation direction. Mutual busbar electrodes are arranged overlappingly via insulators 32, 33. The busbar electrodes of an IDT electrode at respective centers of the surface acoustic wave elements 20, 21 are connected to balanced I(O) terminals 23, 24. The busbar electrodes other than the IDT electrodes at respective centers of the surface acoustic wave elements 20, 21 are connected to the busbar electrodes of the IDT electrodes of the surface acoustic wave resonators 18, 19 in parallel via the insulators 32, 33. <P>COPYRIGHT: (C)2008,JPO&INPIT |
