发明名称 Rigid-flexible printed circuit board and method of manufacturing the same
摘要 The present invention relates to a rigid-flexible printed circuit board and, more particularly, to a rigid-flexible printed circuit board including CL via holes which can facilitate electrical connection to an inner circuit pattern in a flexible region. Since the coverlays are layered on the entire surface of the double-sided FCCL without previous processing thereof, the via holes are formed in the coverlays while a drilling process is performed to form the via holes, and then the copper plating is performed over the entire surface thereof, it is possible to eliminate the cost of previously processing the coverlays, easily perform a process of provisionally layering the coverlays on the double-sided FCCL, and decrease the cost therefor.
申请公布号 US2008014768(A1) 申请公布日期 2008.01.17
申请号 US20070708456 申请日期 2007.02.21
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE YANG JE;SHIN IL WOON;KIM GOING SIK;HONG DOO PYO;KIM HA IL;AN DONG GI
分类号 H05K1/00;H05K3/00 主分类号 H05K1/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利