SEMICONDUCTOR MODULE AND HEAT RADIATING PLATE

摘要

A semiconductor module and a heat-radiating plate are provided to enhance thermal stability by radiating effectively heat. A module main body(10) includes a substrate(12) and a plurality of kinds of semiconductor devices mounted on the substrate. The semiconductor devices have different levels in the amount of heat. Heat radiating plates are mounted to cover outer faces of the semiconductor devices over two or more pieces of the semiconductor devices. A heat conducting sheet is inserted between the module main body and each of the heat radiating plates. In the heat conducting sheets, the heat conductivity of the heat conducting sheet used for the semiconductor device having a large amount of heat is higher than the heat conductivity of the heat conducting sheet used for the semiconductor device having a small amount of heat.