| 摘要 |
An LED package and a manufacturing method thereof are provided to improve light collecting efficiency by adjusting an outlet angle of a visual beam according to a height and a shape of an encapsulation of silicon or epoxy. An LED package comprises a metal pattern(103), a chip, and an encapsulation unit(109). The metal pattern is formed on a planar substrate to a height greater than 70 mum, and includes a difference portion. The chip is mounted on the metal pattern and emits a visible ray. The encapsulation unit is formed on a protruded region of the difference portion which is formed by the metal pattern. The encapsulation unit has a desired height and a desired shape.
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