A EJECT PIN FOR SOLDER BALL ATTACH TOOL USING MEMS TECH AND MAKING METHOD THEREFORE

摘要

A method for manufacturing an ejection pin for a solder ball attaching tool by using MEMS technology and the ejection pin are provided to mount a solder ball on a substrate, on which a semiconductor device is fabricated, with required level of integration. A mold(40) for manufacturing an ejection pin for a solder ball attaching tool is made by using MEMS(Micro Electro Mechanical System) technology. Pressure is applied to an internal space of the mold to fill the mod with a molten metal in such a way the molten metal is densely filled in the mold with forming no bubble. The molten metal filled in the mold is cooled, and then the molded ejection pin is released from the mold. A metal plate(23) is attached on an upper surface of the ejection pin.