发明名称 APPARATUS AND METHOD FOR TREATING SUBSTRATE
摘要 A substrate treating method and a substrate treating apparatus are provided to improve a substrate treating efficiency by changing a spraying type according to a kind of a process solution. A substrate treating apparatus includes a vessel(120), a support member(140), a nozzle(210), a transfer member(220), and a controller(400). A process space is formed in the vessel. The support member supports a substrate in the container during a process. The nozzle sprays first and second process solutions on the substrate, which is supported on the support member, during the process. The transfer member swings the nozzle on the substrate during the process. The controller controls the nozzle, such that the first process solution is sprayed according to a predetermined amount. The controller controls the nozzle according to a predetermined swing number of the nozzle, while the second process solution is supplied.
申请公布号 KR100793173(B1) 申请公布日期 2008.01.10
申请号 KR20060137705 申请日期 2006.12.29
申请人 SEMES CO., LTD. 发明人 PARK, CHUN HEE;KIM, HEE SUK
分类号 H01L21/304 主分类号 H01L21/304
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