| 摘要 |
In a socket for electrical parts of the present invention, a fixed contact piece-a counterpart to the movable contact piece-is formed on a contact pin arranged on the socket body, a fixed-side contact portion which is designed to contact a lower side of the IC lead of the IC package is formed on the fixed contact piece, while a plurality of slits vertically penetrating a mold guide is formed spaced apart with a predetermined distance and the movable-side contact portions are inserted into slits respectively in order for an upper edge portion of the movable-side contact portion to be faced upward.
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