The invention relates to a proximity sensor (1) comprising a sensor housing with an outer housing shell (3) and an inner housing shell (15) that is moulded onto the inner wall (7) of the outer shell by injection moulding. A moulded base (17) divides the housing interior into two sub-chambers (19a, 19b). Contact elements (21), which can be used to establish solder-free connections to contact surfaces on a PCB (10), are sunk into said base (7). The front end of the sensor housing is sealed by a welded plastic cap (35). Potting of the sensor housing with a curing casting resin is not required.
申请公布号
WO2007131372(A3)
申请公布日期
2008.01.10
申请号
WO2007CH00224
申请日期
2007.05.04
申请人
BAUMER ELECTRIC AG;JENNE, BERND;REETMEYER, BURKHARD