发明名称 Method for Bonding Two Free Surfaces, Respectively of First and Second Different Substrates
摘要 A method for bonding two free surfaces, respectively of first and second different substrates, includes a formation step, on the free surface of the first substrate, of a self-assembled mono-molecular layer consisting of a thiol compound of the SH-R-X type, where -R is a carbonaceous chain and -X is a group selected from the group consisting in -H, -OH and -COOH, at least said free surface of the first substrate being formed by a material able to form molecular bonds with the -SH group of the thiol compound. The method also includes preparing the free surface of the second substrate consisting in saturating the free surface of the second substrate with -H groups if -X is a -H group or with -OH groups if -X is selected from the group consisting in -OH and -COOH, and placing the two free surfaces in contact.
申请公布号 US2008009123(A1) 申请公布日期 2008.01.10
申请号 US20050667919 申请日期 2005.12.06
申请人 COMMISSARIAT A LENERGIE ATOMIQUE 发明人 KOSTRZEWA MAREK;DI CIOCCIO LEA;DELAPIERRE GUILLAUME
分类号 H01L21/30 主分类号 H01L21/30
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