| 摘要 |
A heat dissipation device for removing heat from an electronic component includes separated first and second heat sinks and a plate-type heat pipe. The first heat sink has a side oriented to the second heat sink and defines a notch in the side thereof. The second heat sink defines a channel therein. The heat pipe includes a heat-absorber at one end thereof and a heat-exhauster at an opposite end thereof. The heat-absorber is attached into the notch and has a main surface facing the second heat sink. The heat-exhauster is fittingly engaged into the channel of the second heat sink to position the second heat sink thereon. The heat-exhauster dissipates heat transferred from the heat-absorber to the second heat sink.
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