SEMICONDUCTOR DEVICE HAVING DEFECT DETECTING FUNCTION

摘要

A semiconductor device (1) capable of detecting a breakage generated on a chip outer regions causing a defect in future includes: wiring (3) formed to detect breakage along the outer regions of a semiconductor chip (2d); a detection circuit (4) arranged on a semiconductor chip (2) for supplying a detection signal for detecting disconnection of the wiring (3), to the wiring (3); an output terminal (5) for outputting the detection signal which has flown through the wiring (3); an internal circuit (6) arranged on the semiconductor chip (2); an output switching circuit (7) for selecting the output signal from the internal circuit (6) or the detection signal which has flown through the wiring (3) and supplying the selected one to the output terminal (5); a heating body (15a) for heating the chip outer regions; a power supply circuit (16) for driving the heating body; and a temperature detection/control circuit (17) for controlling heating by the heating body. With the aforementioned configuration, it is possible to easily detect a chip breakage by a logic test without increasing the number of measurement terminals and detect in advance, a chip which may fail when mounted.