发明名称 Anordnung und Verfahren zum Verbinden ummantelter Leitungen
摘要 A connecting structure includes a shield wire 1, a ground wire 2, an upper resin tip 15, a lower resin tip 16, and a low-melting welding material 17. First, the ground wire 2 is overlaid on the shield wire 1 in cross. Next, overlapping portions of the shield wire 1 and the ground wire 2 are interposed between the resin tips 15 and 16. By oscillating the resin tips 15 and 16 with ultrasonic waves, respective outside rinds 1d, 2d of the wires 1,2 are removed in the vicinity of the overlapping portions. A braided wire 1c of the wire 1 is electrically connected with a core line 2a of the wire 2 and, simultaneously, the resin tips 15 and 16 are welded to each other to seal up the vicinity of a connecting part S1. With the ultrasonic oscillation, a low-melting materials 17 is molten to flow into the connecting part S1, so that the braided wire 1c of the wire 1 is joined to the core line 2a of the wire 2 through the molten material 17.
申请公布号 DE19913298(B4) 申请公布日期 2008.01.10
申请号 DE1999113298 申请日期 1999.03.24
申请人 YAZAKI CORP. 发明人 TANIKAWA, SATOSHI;ASAKURA, NOBUYUKI
分类号 H01R4/66;H01R4/70;B23K20/10;B29C65/08;H01R4/02;H01R9/05;H01R43/02 主分类号 H01R4/66
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