BALL GRID ARRAY (BGA) CONNECTION SYSTEM AND RELATED METHOD AND BALL SOCKET

摘要

A ball grid array (BGA) connection system includes an integrated circuit (IC) package that includes a plurality of conductive balls forming a ball gr id array (BGA) arranged in a matrix pattern. A printed circuit board (PCB) i ncludes a plurality of ball sockets arranged in a corresponding matrix patte rn. Each ball socket includes a base having one side that engages the PCB an d an opposing side configured for seating a conductive ball of the BGA. A pl urality of prongs are secured to and extend from the base and configured to receive and hold a conductive ball into contact with the base.