发明名称 BALL GRID ATTACHMENT
摘要 A device and method employing an electrically conductive adhesive for electrically and mechanically connecting an electrical component to a board substrate. The electrical component can include an integrated circuit and the board may include a printed circuit board. The possible adhesives include a silver conducting RTV, silver- conducting adhesive, as well as silver conducting epoxy.
申请公布号 WO2007061996(A3) 申请公布日期 2008.01.10
申请号 WO2006US44989 申请日期 2006.11.20
申请人 BAKER HUGHES INCORPORATED;BELL, SAMUEL, R. 发明人 BELL, SAMUEL, R.
分类号 H01L21/00;H01R4/04 主分类号 H01L21/00
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