| 摘要 |
A semiconductor package and its fabrication method are disclosed. The fabrication method has the steps of: providing at least a lead frame having a plurality of terminal leads formed with flat portions and contacting portions, providing at least a circuit board having a plurality of electrical connection pads, mounting the contacting portions on and electrically connecting to the electrical connection pads, attaching and electrically connecting electronic elements to the circuit board, forming an encapsulant for encapsulating the lead frames and the electronic elements but uncovering the flat portions of the terminal leads, and cutting around the circuit board along a cutting path that crosses through each of the terminal leads so as to allow each of the terminal leads to be electrically independent, wherein the terminal leads are employed to act as the electrical terminals of USB memory cards for storing or retrieving data.
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