| 摘要 |
A method and an apparatus for cutting a semiconductor-bonded film are provided to maintain a constant operation speed of a cutting portion by driving the cutting portion using a cam instead of a cylinder. An apparatus for cutting a semiconductor-bonded film includes a holder member(110), first and second punching holder members(140a,140b), and first and second punching members. A guide groove for guiding a film is formed on the holder member. The first and the second punching holder members are connected to the holder member through at least one support member. The first and the second punching members are arranged on the first and the second punching holder members, respectively, to cut the film. The first and the second punching members are driven simultaneously or alternatively to cut the film.
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