发明名称 |
Method for testing chips electrically |
摘要 |
<p>The method involves disposing chips (2) on a chuck (6) with sides of the chips opposite to a film (4). The chips are contacted by a measuring needle (1) penetrating the film that is moved relative to the chips. An electrical measuring procedure is performed, and the measuring needle is heated. A camera system is used for location detection of the chips. A relative movement is terminated for contacting between the measuring needle and the chips when reaching a desired value in an electrical measuring system, and a measuring mode is started.</p> |
申请公布号 |
EP1876454(A1) |
申请公布日期 |
2008.01.09 |
申请号 |
EP20070111644 |
申请日期 |
2007.07.03 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
GERHARD, DETLEF;HEIM, RALF;LECHNER, JOHANNES |
分类号 |
G01R1/04;G01R31/28 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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