发明名称 |
Chemical-mechanical planarization composition having ketooxime compounds and associated method for use |
摘要 |
A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition contains a ketoxime compound and water. The composition may also contain an abrasive and/or a per compound oxidizing agent. The composition affords tunability of removal rates for metal, barrier material, and dielectric layer materials in metal CMP. The composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., step 2 copper CMP processes).
|
申请公布号 |
US7316977(B2) |
申请公布日期 |
2008.01.08 |
申请号 |
US20060508427 |
申请日期 |
2006.08.23 |
申请人 |
AIR PRODUCTS AND CHEMICALS, INC. |
发明人 |
SIDDIQUI JUNAID AHMED;COMPTON TIMOTHY FREDERICK |
分类号 |
H01L21/302;C09K13/00;C11D7/32;H01L21/461 |
主分类号 |
H01L21/302 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|