| 摘要 |
The present invention relates to a press for encapsulating electronic components, comprising: two displaceable mould parts, feed means for encapsulating material, and a drive mechanism provided with a fluid bed connecting onto the mould parts. The present invention also provides a press which is provided with a displacer whereby the encapsulating material fed between the mould parts by the feed means can be placed under an increased pressure. Furthermore, the present invention relates to methods for encapsulating electronic components with encapsulating material in such presses. |
