LEAD FRAME FOR SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE

摘要

A leadframe for a semiconductor package is provided to improve the reliability of a package and reduce the cost of assembly by performing a sintering process on an inner lead part. A semiconductor chip is mounted on a leadframe(40) having a plurality of leads including an outer lead part(51) and an inner lead part(52). The outer lead part is disposed in the outermost part of the lead. The inner lead part is disposed inside the outer lead part, having a smaller thickness than that of the outer lead part. At least one surface of the inner lead part is sintered so that a vertical distance from the upper surface of the outer lead part to the upper surface of the inner lead part is longer than a vertical distance from the lower surface of the outer lead part to the lower surface of the inner lead part.