| 摘要 |
A sputtering device for depositing a thin film is provided to deposit the thin film selectively at a specific position on a substrate. A sputtering device for depositing a thin film(300) comprises a support(310), a target(320), and a plate(410,420). The support supports a substrate(200). The target is corresponded to the substrate. The plate is moved at X and Y directions between the target and the substrate to change an exposed area of the substrate. The plate is formed by an aluminum material. The plate is moved by a stepping motor(430,440). An area which is exposed by the plate among surfaces of the substrate is changed by moving the plate at the X and Y directions by the stepping motor.
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