| 摘要 |
A method of removing organic-containing layers, such as photoresists, high temperature organic layers, or organic dielectric materials, from large surface area substrates by plasma treatment at or near atmospheric pressure, wherein said large surface area substrate is transported on a conveyor belt system during said plasma treatment. The plasma is typically principally comprised of a chemically non-reactive species, such as helium. The method can be integrated in-line with the wet strip and/or wet clean, or it can be used in a stand alone system. The apparatus for carrying out the method is also described.
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