SPUTTERING TARGET/BACKING PLATE CONJUNCTION ELEMENT

摘要

A sputtering target/copper-zinc alloy backing plate conjunction assembly element characterized by having a structure such that pure copper is embedded in the backing plate position at the central part of the target. A simple structure of sputtering target/backing plate capable of satisfactorily coping with realization of higher power can be provided from an inexpensive copper-zinc alloy backing plate excelling in strength and eddy current resistance characteristics without detriment to its properties.