| 摘要 |
A semiconductor package is provided to reduce a size by forming bonding pads with a polygonal structure and arranging the bonding pads in a zigzag shape. A semiconductor chip includes a plurality of bumps formed in a constant interval on a surface thereof. A substrate has a first surface to which a semiconductor chip is attached, and a second surface. The first surface includes a plurality of bonding pads(110) arranged in an arranging direction of bumps. The second surface includes a plurality of pads to be electrically connected to the bonding pads. A wire is formed to connect the bumps with the bonding pads electrically. The bonding pads are arranged in a plurality of columns(111a,111b). An overlapped surface(112) of the bonding pads has a constant slope. The bonding pads are formed with a polygonal structure. The bonding pads have a zigzag shape in the arrangement thereof. |
