发明名称 Humidity reactive hot melt adhesive with increased open time
摘要 <p>Moisture reactive melt adhesive composition (A) comprises at least an isocyanate group containing polyurethane prepolymer that is liquid at room temperature, and at least a linear polyurethane that is solid at room temperature, containing polycaprolactone segment and a hydroxyl group and a melt viscosity of 100-300 Pa.s at 170[deg]C. Independent claims are included for: (1) a method of attaching a first substrate and a second substrate comprising heating (A) at 40-120[deg]C, preferably 60-90[deg]C, applying the heated (A) on the surface of a first substrate, joining the surface of the second substrate with the first substrate by applying (A) within the space time, and hardening (A) using water, where the first- and the second substrate are different material; and (2) a bound article obtained from the process.</p>
申请公布号 AU2007264939(A1) 申请公布日期 2008.01.03
申请号 AU20070264939 申请日期 2007.06.29
申请人 SIKA TECHNOLOGY AG 发明人 UKIWO ONUOHA
分类号 C09J175/06;C08G18/12;C08G18/42;C08G18/48;C08G18/76 主分类号 C09J175/06
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