| 摘要 |
<p>A power amplifier module (IC module) of stacked layer structure is miniaturized while dissipating heat from a power amplifier chip. The module includes a first LTCC wiring board having a cavity in which a power amplifier chip is embedded, and a plurality of vias, which are electrically connected to ground, immediately underlying the power amplifier chip; and a second LTCC wiring board joined to the first LTCC wiring board and incorporating a matching circuit and a bias circuit electrically connected to the power amplifier chip. Ground pads of the matching circuit and bias circuit are all grounded by separating wiring or vias in the first LTCC wiring board and second LTCC wiring board.</p> |
