METHOD FOR MANUFACTURING ELECTRONIC PACKAGE

摘要

A method for manufacturing an electronic package is provided to simplify processes and to improve reliability by forming a thermal conductive layer through an ink jet manner. An electronic device is prepared(S11). A thermal conductive adhesive ink is coated on a surface of the electronic device by using an ink jet manner(S12). The thermal conductive adhesive ink is made of an adhesive medium and a thermal conductive particle. A heat release unit is coupled to the surface of the electronic device on which the thermal conductive adhesive ink is coated(S13). The thermal conductive adhesive ink is filtered. The heat release unit is coupled through a thermo-compression bonding. The heat release unit is comprised of a heat release plate coupled to the surface of the electronic device and a heat release fin formed on the heat release plate.