发明名称 THIN FILM-LAMINATED POLYIMIDE FILM AND FLEXIBLE PRINTED WIRING BOARD
摘要 <p>The thin film-laminated polyimide film contains a substrate film and a thin film layer formed at least on one surface of the substrate film. The substrate film is made of a polyimide film showing a degree of curl after a heat treatment at 300°C of not more than 10%. Use of this thin film-laminated polyimide film as a substrate of electronic parts such as solar battery, capacitor and the like exposed to high temperatures prevents easy development of warpage and distortion during production, and can improve quality and yield of electronic parts.</p>
申请公布号 EP1872941(A1) 申请公布日期 2008.01.02
申请号 EP20050757943 申请日期 2005.07.01
申请人 TOYO BOSEKI KABUSHIKI KAISHA 发明人 MAEDA, SATOSHI;KAWAHARA, KEIZO;TSUTSUMI, M.;YOSHIDA, TAKEFUMI
分类号 B32B27/34 主分类号 B32B27/34
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