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发明名称
半导体封装基底、半导体封装体的结构及其形成方法
摘要
本发明系提供一种半导体封装基底、半导体封装体的结构及其形成方法。在一实施例中,上述半导体封装体的形成方法包括提供一基底,其上方形成有一凸块垫。提供一焊料罩幕层于该凸块垫上方,且该焊料罩幕层之中具有至少一开口,以暴露部分该凸块垫。形成一可湿润焊料之沈积层于该凸块垫的暴露表面上及该焊料罩幕层的侧壁上与边角附近。沈积一焊料材料于该可湿润焊料的沈积层及部分焊料罩幕层上方,以及对该焊料材料进行一回焊步骤,以形成一焊料凸块。
申请公布号
TW200802637
申请公布日期
2008.01.01
申请号
TW095148144
申请日期
2006.12.21
申请人
台湾积体电路制造股份有限公司
发明人
曹佩华;牛保刚;彭大智
分类号
H01L21/56(2006.01);H01L21/60(2006.01);H01L21/50(2006.01)
主分类号
H01L21/56(2006.01)
代理机构
代理人
洪澄文;颜锦顺
主权项
地址
新竹市新竹科学工业园区力行六路8号
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