发明名称 Etching method and apparatus
摘要 An etching apparatus comprises a workpiece holder ( 21 ) for holding a workpiece (X), a plasma generator ( 10, 20 ) for generating a plasma ( 30 ) in a vacuum chamber ( 3 ), an orifice electrode ( 4 ) disposed between the workpiece holder ( 21 ) and the plasma generator ( 10, 20 ), and a grid electrode ( 5 ) disposed upstream of the orifice electrode ( 4 ) in the vacuum chamber ( 3 ). The orifice electrode ( 4 ) has orifices ( 4 a) defined therein. The etching apparatus further comprises a voltage applying unit ( 25, 26 ) for applying a voltage between the orifice electrode ( 4 ) and the grid electrode ( 5 ) to accelerate ions from the plasma ( 30 ) generated by the plasma generator ( 10, 20 ) and to pass the extracted ions through the orifices ( 4 a) in the orifice electrode ( 4 ), for generating a collimated neutral particle beam having an energy ranging from 10 eV to 50 eV.
申请公布号 US7314574(B2) 申请公布日期 2008.01.01
申请号 US20040484502 申请日期 2004.08.09
申请人 EBARA CORPORATION 发明人 ICHIKI KATSUNORI;YAMAUCHI KAZUO;HIYAMA HIROKUNI;SAMUKAWA SEIJI
分类号 B44C1/22;G21K1/00;G21K5/04;H01J37/32;H01L21/00;H01L21/302;H01L21/3065;H01L21/461;H05H3/02 主分类号 B44C1/22
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