METHOD AND APPARATUS FOR PACKAGING INTEGRATED CIRCUIT DEVICES

摘要

AN INTEGRALLY PACKAGED INTEGRATED CIRCUIT DEVICE INCLUDING AN INTEGRATED CIRCUIT DIE (22) INCLUDING A CRYSTALLINE SUBSTRATE HAVING FIRST AND SECOND GENERALLY PLANAR SURFACES (26) AND EDGE SURFACES (25) AND AN ACTIVE SURFACE (24) FORMED ON THE FIRST GENERALLY PLANAR SURFACE (26), AT LEAST ONE CHIP SCALE PACKAGING LAYER (20) FORMED OVER THE ACTIVE SURFACE (24) AND AT LEAST ONE ELECTRICAL CONTACT FORMED OVER THE AT LEAST ONE CHIP SCALE PACKAGING LAYER (20), THE AT LEAST ONE ELECTRICAL CONTACT BEING CONNECTED TO CIRCUITRY ON THE ACTIVE SURFACE (24) BY AT LEAST ONE PAD (16) FORMED ON THE FIRST GENERALLY PLANAR SURFACE (26).(FIG 7A)