| 摘要 |
PROBLEM TO BE SOLVED: To provide a flip-chip package in which contact resistance is reduced, a bonding effect is improved, and further superior reliability is provided, and to provide a method for manufacturing it. SOLUTION: This flip-chip package includes a first substrate 11 and a second substrate 12 on which pads are formed, respectively, a barrier formed on the first or second substrate, and an anisotropic conductive connection material which electrically connects the pads 13 and 14 of the first and second substrates. COPYRIGHT: (C)2008,JPO&INPIT |
