| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer substrate capable of easily and firmly connecting low boards. <P>SOLUTION: The method of manufacturing the multilayer substrate comprises the steps of applying bonding ink 20, in which filler constituted by plating the surface of a metal particle having a first melting point with solder having a second melting point lower than the first melting point and a curing agent are contained in thermosetting resin, onto the terminal 12a of a first low board 12; adhering an adhesive sheet 24 in which a through hole 22 is formed in a portion corresponding to the terminal 14a of a second low board 14, and which comprises the thermosetting resin to the second low board 14; and integrating the first low board 12 and the second low board 14 by interposing the adhesive sheet 24 between the low boards, making the terminal portions opposed to each other, carrying out heating and voltage application, and thermosetting the adhesive sheet 24 and the bonding ink 20. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
