| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive pattern which can improve bondability to a base material, is excellent in curl resistance and base material planarity, and is excellent in plating processing suitability; and to provide a manufacturing method thereof. SOLUTION: In the manufacturing method of the conductive pattern, the conductive pattern is formed on an ink acceptable base material via a process of forming a conductive pattern image using a conductive ink, and a heating/pressurizing process of simultaneously applying thermal energy and pressure to the formed conductive pattern image. COPYRIGHT: (C)2008,JPO&INPIT
|
