SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing the curvature of a wiring substrate in the semiconductor device constituted by carrying out the flip-chip bonding of a semiconductor chip and the like to the wiring substrate.

SOLUTION: The flip-chip bonding of a semiconductor chip 40 is carried out to the wiring layer 18 of the upper surface side of a body 10 to be mounted. A dummy chip 30 for preventing the curvature of the body 10 to be mounted is bonded to a region corresponding to the semiconductor chip 40 of the lower surface side of the body 10 to be mounted. An external connecting terminal 26 whose height is higher than that of the dummy chip 30 is provided on the peripheral side of the lower surface of the body 10 to be mounted.

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