发明名称 Memory device and manufacturing method and operating method thereof
摘要 A memory device including a substrate, a plurality of conductive layers, a composite dielectric layer and a plurality of gates are provided. Wherein, the conductive layers are disposed on the substrate. The composite dielectric layer is disposed on the substrate and covers the conductive layers. The composite dielectric layer includes a charge trapping layer. The gates are disposed on the composite dielectric layer and across the conductive layers. Wherein, the conductive layers can be used as local bit lines to reduce the resistance values and improve the performance of the memory device.
申请公布号 US2007296024(A1) 申请公布日期 2007.12.27
申请号 US20060475269 申请日期 2006.06.26
申请人 LIU CHENG-JYE;HSIUNG TAI-LIANG 发明人 LIU CHENG-JYE;HSIUNG TAI-LIANG
分类号 H01L29/792 主分类号 H01L29/792
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