| 摘要 |
A packaging structure and an assembly method are disclosed. A packaging structure includes a substrate, a die, conductive wires, and conductively filled material. The substrate includes a conductive structure, and the conductive wires are insulator-coated. The die is mounted on the substrate, and the conductive wires are connected between the die and the conductive structure. The conductively filled material is formed among the conductive wires. In the assembly method, the die is firstly mounted on the substrate, followed by connecting the conductive wires between the die and the conductive structure, and finally forming the conductively filled material among the conductive wires. |
