| 摘要 |
<P>PROBLEM TO BE SOLVED: To lower the cost of a semiconductor device module and to improve an yield. <P>SOLUTION: An insulation layer is formed on a metal base material, and a copper foil pattern is formed on it (step S3). Then, a solder resist layer is formed on the insulation layer so as to cover a part of the copper foil pattern (step S4), and water soluble heat resistant pre-flux is applied to the surface of the copper foil pattern when a metal film surface is exposed (step S5). Then, cream solder is applied on a metal film (step S6), and in order to install a semiconductor element on it (step S7), reflow is executed (step S8). After removing impurities (step S9), a wire is directly joined to the electrode of the semiconductor element and the copper foil pattern by an ultrasonic bonding method (step S10). Thus, the cost of the semiconductor device module is lowered and the yield is improved. <P>COPYRIGHT: (C)2008,JPO&INPIT |
