发明名称 METHOD OF FORMING PATTERN OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of forming a wiggle-shaped pattern of a semiconductor device not by lithography. SOLUTION: The method of forming a pattern of a semiconductor device comprises steps of depositing a processing film on a semiconductor substrate, depositing a mask film having a varying etching characteristic on the processing film by doping an impurity in the processing film, forming a line pattern on the mask film, selectively doping an impurity in a desired region of the mask film having the line pattern formed thereon to provide a varying etching rate, forming a mask pattern having partially different line widths and including a wiggle shape by selectively etching the line pattern of the mask film, and forming a wiggle shaped pattern by etching the processing film with the mask pattern used as a mask. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007335660(A) 申请公布日期 2007.12.27
申请号 JP20060166193 申请日期 2006.06.15
申请人 TOSHIBA CORP 发明人 TANAKA TOSHIJI
分类号 H01L21/28;H01L21/3065;H01L21/3213;H01L21/8234;H01L27/088;H01L29/41;H01L29/423;H01L29/49 主分类号 H01L21/28
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