| 摘要 |
PROBLEM TO BE SOLVED: To provide a hot-dipped wire having excellent appearance and capable of ensuring the workability and the corrosion resistance of the hot-dipped wire, and to provide a cooling device for manufacturing the hot-dipped wire. SOLUTION: The hot-dipped wire is characterized in that the mean grain size of surface solidified crystal grains of a hot-dipped layer having the coating weight of≥250 g/m<SP>2</SP>is 10-200μm. In the hot-dipped wire cooling device, water-cooling nozzles are provided in a cooling cylinder around the hot-dipped wire so as to obtain the hot-dipped wire, and gas blowing nozzles capable of varying the ejection angle are arranged below the nozzles, and a mechanism capable of directly performing the water cooling of the surface of the hot-dipped wire is provided. The hot-dipped wire cooling device has a mechanism in which the position of the water-cooling nozzles is slidable in the moving direction of the hot-dipped wire so as to start the cooling of the hot-dipped wire in a temperature range between the solidification temperature and the solidification temperature -70°C. COPYRIGHT: (C)2008,JPO&INPIT
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