CMP-apparatus retainer ring and manufacturing method thereof, and CMP apparatus

摘要

A retainer ring is provided which is capable of, effectively in practice, restraining the time taken for a break-in polish to the minimum. This retainer ring 8: is disposed inside of a holding head 4 in a CMP apparatus 1 which polishes a wafer W chemically and mechanically; has a ring shape so as to surround the periphery of the wafer W; presses a polish surface 3 a of a polish pad 3; is made of an engineering plastic material such as PPS; and has a pressure surface 8 a for pressing the polish surface 3 a of the polish pad 3 whose surface roughness is a center-line average roughness (Ra) of 0.01 mum or below.