| 摘要 |
An integrated circuit including an interlayer dielectric which may be prone to failure due to processing conditions may be protected by coupling the integrated circuit to a substrate through a solder ball over a conductive polymer. The conductive polymer allows conduction of electrical current to or from the integrated circuit and also provides cushioning against stresses including both mechanical perturbations and thermal expansion and contraction. As a result, relatively lower dielectric constant materials may be utilized as interlayer dielectrics within the integrated circuit. |
