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发明名称
Improved led device
摘要
A silver based highly thermally conductive adhesive 5 is used to attach the LED chips 3 to the heatsink 7. The adhesive comprises nanometer grade silver powder and beryllium oxide.
申请公布号
GB0722539(D0)
申请公布日期
2007.12.27
申请号
GB20070022539
申请日期
2007.11.16
申请人
WITTENBERG, URIEL M
发明人
分类号
H01L33/64
主分类号
H01L33/64
代理机构
代理人
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