Converter module

摘要

The module (64) has a pair of power semiconductor chips (10, 12) e.g. insulated gate bipolar transistor, with a contact surface (20) on a side (18) and a contact surface (24) on opposite side (22). The contact surfaces are connected with a cooling body (28). A printed circuit board (36) is provided on the side (22) for contacting the contact surface (24) and a gate (26). Driver electronic devices (38) are provided at the printed circuit board for the gate. The circuit board and the power semiconductor chips are pressed against the cooling body by a pressure device (40).