| 摘要 |
The purpose is to reduce the curling of a flexible cupper-clad laminated substrate which occurs when a resin solution is applied directly on an ultrathin copper foil with a heat-resistant carrier to form a resin layer on the substrate and then the carrier is peeled off. A method for producing a flexible copper-clad laminated substrate (6) having a resin layer (1) and an ultrathin copper foil (2), the method comprising, in an ultrathin copper foil with a heat-resistant carrier in which the ultrathin copper foil (2) is provided on the carrier (4) thorough a releasable layer (3), applying a resin solution onto the ultrathin copper foil, drying and thermally treating the resin solution to form the resin layer (1) which is composed of one or more layers on the ultrathin copper foil with the heat-resistant carrier, thereby producing a multi-layer laminate, and removing the carrier from the laminate. In the multi-layer laminate provided before the removal of the carrier, a force for causing the laminate to curl inwardly on the carrier-side is applied to the laminate and then the carrier is peeled off from the substrate. Thus, a flexible cupper-clad laminated substrate (6) can be produced which is reduced in the degree of curling. |
