| 摘要 |
The invention relates to a method and device for transferring a chip (18), which is arranged on a transfer substrate (26), to a contact substrate (50) and for contacting the chip to the contact substrate, during which the chip, which is adhesively attached via its rear side (19) to a holding surface of the transfer substrate, said holding surface facing the contact substrate. The rear side of the chip is subjected to the action of laser energy passing through the transfer substrate, and a pressing device (45, 46) acting upon the rear of the chip and through the transfer substrate brings the chip, via its chip contacts (59, 60) located opposite a contact surface (58) of the contact substrate, into contact with substrate contacts (56, 57) located on the contact surface, and a thermal connection is established between the chip contacts and the substrate contacts. |
