| 摘要 |
A substrate processing method is provided to replace deionized water in a concave part with a high aspect ratio by an organic solvent by increasing the mixture ratio of an organic solvent in a dry pretreatment solution supplied to a substrate. Deionized water is supplied to a main surface of a target substrate to clean the substrate. A dry pretreatment solution including an organic solvent with volatility higher than that of deionized water is supplied to the main surface of the substrate so that the deionized water remaining on the main surface is replaced by the dry pretreatment solution. The dry pretreatment solution supplied to the main surface of the substrate is removed to dry the substrate. The dry pretreatment process includes a mixture solution supply process and a mixture ratio varying process. In the mixture solution supply process, a mixture solution including deionized water and the organic solvent is supplied as the dry pretreatment solution to the main surface of the substrate. In the mixture ratio varying process, the ratio of the organic solvent in the mixture solution including deionized water and the organic solvent is increased while the mixture solution supply process is performed. The organic solvent with volatility higher than that of deionized water can include at least one of methanol, ethanol, acetate, IPA(isopropyl alcohol), HFE(hydrofluoric ether) and MEK(methylethylketone).
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