HYDROPHOBIC COMPOSITIONS FOR ELECTRONIC APPLICATIONS
摘要
Disclosed area compositions comprising: a polyimide resin with a water absorption of 2% or less and, optionally, one or more of an electrically insulated filler, a defoamer and a colorant and one or more organic solvents. The compositions are useful as encapsulants and have a consolidation temperature of 190°C or less.
申请公布号
WO2007146382(A2)
申请公布日期
2007.12.21
申请号
WO2007US13965
申请日期
2007.06.13
申请人
E. I. DU PONT DE NEMOURS AND COMPANY;DUEBER, THOMAS, E.;SUMMERS, JOHN, D.
